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product structure: silicon monolithic integrated circuit ? this product is not designed for pr otection against radioactive rays 1/43 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 14 ~ 001 datashee t tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 power management ic for automotive microcontroller buck-boost switching regulator + ldo + reset + watch dog timer bd39002efv-c general description bd39002efv-c is a power management ic with buck-boost switching regulator controller (dc / dc1), ldo, reset and wdt. the bd39002efv-c includes protection circuits, such as under voltage, over voltage, over current and tsd. features ? automatically controlled buck-boost switching regulator with 40 v rated v cc , dc / dc and ldo input ? 5 v fixed output secondary ldo ? configurable sequence control ? over current protection dc / dc1: adjustable voltage with external resistors ldo: integrated ? over voltage / under voltage detection ? reset for ldo and wdt ? window watchdog timer ? htssop-b30 package applications ? microcontroller for automotive key specifications input voltage range 4.0 v to 30 v (startup voltage needs to be above 4.5v.) output voltage buck-boost dc / dc1 fb voltage 0.8 v secondary ldo 5.0 v reference voltage accuracy buck-boost dc / dc1 fb voltage 2 % secondary ldo 2 % oscillation frequency 200 to 550 khz max output current secondary ldo 600 ma stand-by current 0 a (typ) operating temperature range -40 c to 125 c aec-q100 qualified package w (typ) d (typ) h (max) htssop-b30 10.00 mm 7.60 mm 1.00 mm typical application circuit simplified circuit1 simplified circuit2 buck-boost switching regulator + secondary ldo buck switching regulator + secondary ldo # # _ _ # # downloaded from: http:///
2/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 pin configuration (top view) pin description pin no. symbol function pin no. symbol function 1 vl pch fet gate clamp 16 pg1 power good output for dc / dc1 ? 2 n.c. not connected ? 17 rstwd# reset output for wdt ? 3 outh pch mosfet drive ? 18 rst2# reset output for ldo ? 4 n.c. not connected ? 19 enwd wdt enable pin ? 5 cl overcurrent detection setting ? 20 clk clock input ? 6 vcc supply voltage input ? 21 ct reset delay ? 7 en1 output on / off for dc / dc1 ? 22 rtw frequency setting for wdt ? 8 t3 test pin (note 1) ? 23 rt frequency setting ? 9 vreg internal power supply ? 24 gnd ground pin ? 10 en2 output on / off for ldo 25 ss1 soft start time setting for dc / dc1 ? 11 sel_uvlo select pin for vcc uvlo 26 comp1 error-amp output for dc / dc1 ? 12 t4 test pin (note 1) ? 27 fb1 feedback for dc / dc1 ? 13 vs2 supply voltage input for ldo ? 28 vdd nch mosfet drive supply ? 14 vo2 5 v output 29 outl nch mosfet drive ? 15 pg2 power good output for ldo ? 30 pgnd1 power ground ? (note 1) short with gnd downloaded from: http:///
3/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 block diagram downloaded from: http:///
4/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 absolute maximum ratings parameter symbol limits unit vcc voltage (note 1) v cc 40 v vs2 voltage (note 1) v s2 40 v cl voltage v cl vcc v en1 voltage v en1 vcc v vreg voltage v reg 7 v vdd voltage v dd 7 v ss1 voltage v ss1 vreg v rst2#, rstwd# v rst2# , v rstwd# 7 v clk, rtw, ct, enwd v clk , v rtw , v ct , v enwd 7 v pg1, pg2 v pg1 , v pg2 7 v en2 v en2 vreg v power dissipation (note 2) pd 4.69 w storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c (note 1) pd should not be exceeded. (note 2) if mounted on a standard rohm 4 layer pcb (copper fo il area: 70 mm 70 mm) (standard rohm pcb size: 70mm 70 mm 1 .6mm) reduce by 37.52 mw / c (ta 25 c) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as ad ding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating rating parameter symbol min max unit voltage power supply v cc (buck boost mode) 4 (note 1) 30 v v cc (buck mode) 6 30 v v s2 5 10 v oscillation frequency f osc 200 550 khz wdt oscillation frequency f oscw 50 250 khz outh current ability i outh - 1.5 a outl current ability i outl - 1.5 a v o2 current ability i vo2 - 600 (note 2) ma operating temperature ra nge topr -40 +125 c (note 1) initial startup is over 4.5 v (note 2) pd should not be exceeded. downloaded from: http:///
5/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 electrical characteristic (unless otherwise specified: -40 c ta +125 c, 4 v v cc 30 v, 5 v v s2 10 v) parameter symbol limits unit condition min typ max all standby current 1 i st1 - 0 10 a ta = 25 c standby current 2 i st2 - - 30 a ta = 125 c circuit current i vcc 5 8 12 ma rt = 33 k ? , fb1 = 1.0 v oscillation frequency f osc 315 350 385 khz rt = 33 k ? vreg output voltage v reg 3.0 3.5 4.0 v vdd output voltage v dd 4.5 5 5.5 v vcc = 12 v uvlo_vcc detection voltage 1 v uvlovcc1 3.30 3.60 3.90 v sel_uvlo = open uvlo hysteresis voltage 1 v uvvcchys1 200 400 600 mv sel_uvlo = open uvlo_vcc detection voltage 2 v uvlovcc2 5.27 5.58 5.89 v sel_uvlo = gnd uvlo_vcc release voltage 2 v uvvccre2 5.35 5.67 6.0 v sel_uvlo = gnd uvlo hysteresis voltage 2 v uvvcchys2 50 75 - mv sel_uvlo = gnd en1 l threshold v en1l - - 0.5 v en1 h threshold v en1h 2.5 - - v en1 input resistance r en1 180 375 570 k ? vcc = 5 v sel_uvlo threshold v sel_uvlo - v reg / 2 - v sel_uvlo output current i sel_uvlo 5 14 23 a sel_uvlo = 0 v dc / dc1 (buck - boost dc / dc controller) fb1 voltage vref08 0.784 0.800 0.816 v fb1 = comp1 fb1 input bias current i fb1 -1 0 +1 a fb1 = 0.8 v soft start quick charge current i ss0 55 110 165 a soft start charge current i ss1 5 10 15 a soft start selected voltage v ss0 0.3 0.7 1.5 v soft start end voltage 1 v ss1 - v ss0 + v ref08 - v soft start cramp voltage v sscl1 2.2 2.8 3.3 v ss1 = open vcc - vl voltage v l 8 10 12 v vcc 12 v vcc - vl hi - side outh on - resistance r onhh - 1.7 - ? vcc = 12 v outh - vcc lo - side outh on - resistance1 r onhl1 - 3 - ? vcc = 12 v outh - vl lo - side outh on - resistance2 r onhl2 - - 30 ? vcc = 4 v outh - pgnd hi - side outl on - resistance r onlh - 18 - ? vcc = 12 v lo - side outl on - resistance r onll - 22 - ? vcc = 12 v over current detection cl voltage (low) v cl_l 86 100 114 mv vcc - cl voltage, vcc = 12 v over current detection cl voltage (high) v cl_h 172 200 228 mv vcc - cl voltage, vcc = 12 v maximum on duty (outl) t on - 92 - % f osc = 600 khz downloaded from: http:///
6/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 electrical characteristic - continuance parameter symbol limits unit condition min typ max ldo (5.0 v output ldo) output voltage 2 v o2 4.90 5.00 5.10 v 6.0 v vs2 10 v, 5 ma i vo2 600 ma drop voltage ? v o2 - - 0.6 v vs3 = 4.65 v, i vo2 = 600 ma under voltage detection voltage v rst2 4.50 4.625 4.75 v under voltage hysteresis voltage v rsth2 30 - 150 mv en2 threshold voltage v en2 0.6 0.8 1.0 v en2 charge current i en2 4 8 12 a en2 = 0.2 v vs2 over voltage detection voltage v ovvs 12.5 14 15.5 v rst2#, rstwd# reset delay time t rst 30 56 160 ms ct = 0.47 f reset l voltage 1 v rstl1 - - 0.25 v v o2 = 1.0 v, irst = 100 a reset l voltage 2 v rstl2 - - 0.4 v i rst = 1 ma reset response time t phl - - 5 us rst# pull up resistance 4.7 k ? wdt oscillation frequency f oscw 75 100 125 khz r tw = 51 k ? clk fast ng threshold t wf 507 f oscw 512 f oscw 517 f oscw s clk slow ng threshold t ws 6635 f oscw 6655 f oscw 6675 f oscw s wdt reset time t wres 123 f oscw 128 f oscw 133 f oscw s clk l threshold v clkl - - 0.8 v clk h threshold v clkh 2.0 - - v enwd l threshold v enwdl - - 0.8 v enwd h threshold v enwdh 2.0 - - v rstwd on resistance r rstwd 50 100 200 ? i rstwd = 100 a pg1, pg2 pg on - resistance r pg1 r pg2 0.5 1.0 2.0 k ? pg1 under voltage detection voltage v lvpg1 0.62 0.67 0.72 v fb1 voltage pg1 under voltage hysteresis v lvph1 20 - 100 mv fb1 voltage pg1 over voltage detection voltage v ovpg1 0.88 0.94 1.00 v fb1 voltage pg1 over voltage hysteresis v ovph1 20 - 100 mv fb1 voltage pg2 under voltage detection voltage v lvpg2 4.50 4.625 4.75 v v o2 voltage pg2 under voltage hysteresis v lvph2 30 - 150 mv v o2 voltage pg2 over voltage detection voltage v ovpg2 5.25 5.38 5.50 v v o2 voltage pg2 over voltage hysteresis v ovph2 30 - 150 mv v o2 voltage reset response time (t phl ) ? ? ? ? ? uvlo, rst2# delay time ???????? vo2, rst2# delay time v rst2 v o2 t phl 5s rst2# downloaded from: http:///
7/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 0.780 0.785 0.790 0.795 0.800 0.805 0.810 -40 -10 20 50 80 110 fb1 voltage 1: vref08 [v] ambient temperature: ta [c] typical performance curves figure 1. standby current vs. temperature figure 2. circu it current vs. temperature figure 3. fb1 voltage vs. temperature 5.00 6.00 7.00 8.00 9.00 10.00 11.00 12.00 -40 -10 20 50 80 110 circuit current: i cc [m a] ambient temperature: ta [c] figure 4.ooutput voltage2 vs. temperature 4.90 4.95 5.00 5.05 5.10 -40 -10 20 50 80 110 output voltage2: v o2 [v] ambient temperature: ta [c] 0 2 4 6 8 10 -40 -10 20 50 80 110 standby current: istb [ a] ambient temperature: ta [c] downloaded from: http:///
8/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 typical performance curves - continuance 75 85 95 105 115 125 -40 -10 20 50 80 110 wdt frequency: f oscw [khz] ambient temperature: ta [c] 0.5 1.0 1.5 2.0 2.5 -40 -10 20 50 80 110 en1 threshold: en1 [v] ambient temperature: ta [c] 315 325 335 345 355 365 375 385 -40 -10 20 50 80 110 frequency: f osc [khz] ambient temperature: ta [c] figure 5. under voltage detection2 vs. temperature figure 6. frequency vs. temperature figure 7. wdt frequency vs. temperature figure 8. en1 threshold vs. temperature 4.50 4.55 4.60 4.65 4.70 4.75 -40 -10 20 50 80 110 under voltage detection2: v rst2 [v] ambient temperature: ta [c] downloaded from: http:///
9/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 typical performance curves - continuance 0.5 1.0 1.5 2.0 2.5 -40 -10 20 50 80 110 outh high ron r onhh [ ? ] ambient temperature: ta [c] figure 11. outh high ron vs. temperature fi gure 12. outh low ron1 vs. temperature 1.5 2 2.5 3 3.5 4 4.5 -40 -10 20 50 80 110 outh low ron1 r onhl1 [ ? ] ambient temperature: ta [c] figure 9. vcc uvlo threshold voltage1 vs. temperature figure 10. vcc uvlo threshold voltage2 vs. temperature 3.3 3.4 3.5 3.6 3.7 3.8 3.9 -40 -10 20 50 80 110 vcc uvlo threshold voltage1: v uvlovcc1 [v] ambient temperature: ta [c] 5.37 5.42 5.47 5.52 5.57 5.62 5.67 5.72 5.77 -40 -10 20 50 80 110 vcc uvlo threshold voltage2: v uvlovcc2 [v] ambient temperature: ta [c] downloaded from: http:///
10/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 typical performance curves - continuance figure 13. outl high ron vs. temperature figure 14. outl low ron vs. temperature 17 18 19 20 21 22 23 -40 -10 20 50 80 110 outl high ron: v onlh [ ? ] ambient temperature: ta [c] 16.0 17.0 18.0 19.0 20.0 21.0 22.0 -40 -10 20 50 80 110 outl low ron: r onll [ ? ] ambient temperature: ta [c] downloaded from: http:///
11/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 description of blocks ? under voltage lockout circuit (vcc_uvlo) this is a low voltage error prevention circuit. in case of sel_uvlo = open, if the vcc drops below 3.6 v (t yp), the vcc_uvlo is activated and the output circuit shuts down. in case of sel_uvlo = gnd, if the vcc drop s below 5.58 v (typ), the vcc_uvlo is activated and the output circuit shuts down. ? thermal shut down (tsd) the tsd protects the dev ice from overheating. if the chip temperature (tj) reaches 1 75 c (typ), the circuit shuts down ? over voltage detection (ovd) if dc / dc1 and ldo output voltage exceeds ovd, each pgood pin turns low. dc / dc1 ovd monitors fb1 voltage and ldo ovd monitors v o2 voltage. pgood pin is an open drain output and a pull up resistor s hould be connected to pgood if this function is being used. ? low voltage detection (lvd) if dc / dc1 and ldo output voltage is below lvd, each pgood pin turns low. dc / dc1 lvd monitors fb1 voltage and ldo lvd monitors v o2 voltage. pgood pin is an open drain output, and a pull up resistor should be connected to p good if this function is being used. ? over current protection (ocp) dc / dc1 has two levels over current protection with different control system as shown below. 1) ocp1 low level operations (ocp1_l) in case the voltage between vcc and cl exceeds 100 mv (typ), ocp1 (low level operation) is activated and the switching pulse width of outh and the sw itching pulse width of outl are limited . also, if this pulse limited status continues during 256 clock times where the fb1 pin voltage drops below the under voltage detection level, the soft start pin capacitor is discharged and the outpu t is turned off during 8192 clock times. during the 8192 clock in which the output is turned off, the logic of outh and outl pin changes as follows; outh = h and outl = h. after the 8192 clock the chip re turns to normal operations and the soft start pin is recharged. 2) ocp1 high level operations (ocp1_h) in case the inter vcc - cl pin voltage exceeds 200 mv (typ), the chip goes into ocp1 high level operations, the soft start pin capacitor is discharged and the output is turned off for 8192 clk. during the 8192 clock in which the output is turned off, the logic of outh and outl pin changes as follows; outh = h and outl = h. after the 8192 clock the chip returns to normal operati ons and the soft start pin is recharged. figure 15. timing chart for dc / dc1 protection ~ if the output current of ldo exceed ocp, the output current is limited and the output voltage is lowered. =,= =,= downloaded from: http:///
12/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 ? over voltage protection (vs2) in case the vs2 voltage exceeds 14 v (typ), the chip goes into vs2 ovp, the ss1 capacitor is discharged and the dc / dc1 output is turned off for 8192 clock. during the 8192 clock in which the output is turned off, the logic of outh and outl changes as follows; outh = h and outl = h. after the 8192 clock the chip returns to normal operations and the ss1 is recharged. all numerical values are typical. figure 16. vs2 over voltage protection = =,= . . . . downloaded from: http:///
13/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 ? rst#, rstwd# pin in case of enwd = l, rstwd# voltage is pull up voltage. in case of enwd = h, wdt operation starts. if wd t is in abnormal condition, rstwd# outputs l. if v o2 voltage is below the lvd, reset voltage (rst#) output is low. if v o2 exceed the reset release voltage, ct is c harged and after tpor, reset voltage outputs high. figure 17. rst#, rstwd# logic circuit figure 18. rst2#,timing chart figure 19. timing chart (detection of lvd between reset) # . . . . downloaded from: http:///
14/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 ? oscillator for watch dog timer (foscw) this block creates a reference frequency of the watch dog timer. the oscillation frequency is determined by the rtw resistance. the oscillation frequency can be set in the range of 50 khz to 250 khz. ? watch dog timer microcontroller ( c) operation is monitored with clk pin. window watch dog timer is included to enhance the assurance of the system. wdt starts operating when en wd becomes high. clk pin voltage must be low when enwd switches to high. wdt monitors both edges of clk pin (rising edge and falling edge). if width of both edges ar e shorter than fast ng or longer than slow ng, r stwd turns low for a wdt reset time (t wres ). since the width of fast ng and slow ng depends on a number of f oscw , fast ng and slow ng are variable by frequency of f oscw . if f oscw is unusual (ex. rtw is short to ground), r stwd turns low. in case of using rstwd, pull-up resistor is needed because rstwd is an open drain. figure 20. witch dog timer state change diagram (wdt fsm) (1): standby mode, (2): normal mode, (3): c err detect, (4): osc_wdt err de tect (see figure 20. wdt fsm) (5): when enwd is changed low to high, it is necessary that clk is low. figure 21. wdt timing chart standby mode rstwd=high foscw err detect rstwd=low c err detect rstwd=low nomal mode rstwd=high foscw error detection enwd=low enwd=high fast ng or slow ng detection rstwd low range > twres enwd=low rstwd low range < twres foscw error detection c error not detect (fast ng, slow ng not detect) enwd=low # _ _ downloaded from: http:///
15/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 external components selection figure 22. application example 1 ?? downloaded from: http:///
16/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 (1) buck mode ? (vcc >> v o1 ) in case the input voltage is high compared to the output voltage, the chip will go into buck mode, resulting outh to repeatedly switch between h and l and that the outl will go to l (= off). this operation is the same as t hat of standard step-down switching regulators. shown are the outh and outl waveforms on the right. on duty of pmos (d pon ), vcc and v o1 are shown in the following equation. vcc = (eq. 1) (2) buck-boost mode ? (vcc v o1 ) in case the input voltage is close to t he output voltage, the chip will go into buck-boost mode, resulting both the outh and outl to repeatedly switch between h and l. concerning the outh, outl timing, the chip internally controls where the following sequence is upheld; when outh: h ? l, outl: h ? l. shown below are the outh and outl waveforms. ? vcc > v o1 ? vcc < v o1 figure 24 figure 25 *the timing excludes the sw delay the relationship between on duty of pmos (d pon ), on duty of nmos (d non ), vcc and v o1 is shown in the following equation. = (eq. 2) the calculation formula of d pon and d non are shown in page 17. (3) boost mode ? (vcc << v o1 ) in case the input voltage is low compared to the output voltage, the chip will go into boost mode, resulting outh to go to l (= on) and outl will repeatedly switch between h and l. this operation is the same as that of standard st ep-up switching regulators. max duty of outl is lim ited by internal circuit. on duty of nmos (d non ), vcc and v o1 are shown in the following equation. ? = (eq. 3) outl outh i l1 switching switching figure 23 figure 26 outl outh i l1 switching low downloaded from: http:///
17/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 (4) voltage for mode switching and duty control in the event of mode switchin g from boost to buck-boost or vice versa, mode switching input vo ltage is dependent on output voltage, the gain of inverting amplifier and the cross duty. the general description is shown below. the duty of outh is controlled by outpu t of error amp (comp1) and slope voltage. also, outl duty is controlled by the output voltage of the inverting amplifier in chip (boostcomp) and slope voltage. in case vcc = v o1 , comp1 voltage becomes equal to boostcomp vo ltage, and switching control timing of outh and outl becomes identical accordingly. figure 27. buck-boost operation controlled by comp1, boostcomp and slope voltage on duty of pmos in this condition is called the cross duty (dx = 0.85, typ). d pon and d non can be calculated by the following equation, assuming the gain of the in verting amplifier as a (1.5, typ). =? + ? = . ? . (note 1) (eq. 4) from eq.3, eq.4 and d pon = 1, the input voltage at transition between buck - boost and boost mode is calculated as follows; = + ? = . (note 1) (eq. 5) also, from eq.1, eq.4 and d non = 0, the input voltage at transition between buck - boost and buck mode is calculated as follows; = = . (note 1) be sure to confirm dx and a value under the actual application because these parameters vary depending on conditions of use and external components selected. dx varies with oscillating frequency shown in figure 28. in addition, a value can be calculated by d non / d pon . (note 1) a = 1.5 (typ), dx = 0.85 (typ) figure 28. cross duty vs. frequency characteristics boostcomp comp1 buck-boost boost buck cross duty 0% 85 % (typ) 100% slope vcc = vo1 (typ) 81 82 83 84 85 86 87 88 0 100 200 300 400 500 600 700 800 cross duty [%] oscillating frequency [khz] downloaded from: http:///
18/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 1. setting the output l1 value (dc / dc1) it is necessary to use lc filter. the use of a big inductor help s lower the inductor ripple cu rrent and output ripple voltage, even though cost is higher and the size is bigger. the inductance is shown in the following equation. the coil value significantly influences the output ripple current. thus, as seen bellow, the larger coil and the higher switching frequency, the lower ripple current it becomes. t he optimal output ripple current setting is 30 % of maximum current. ~ dc / dc1 (at buck - boost) buck mode buck-boost mode boost mode ? = ? vcc > v o1 ? = ? vcc < v o1 ? = ? ? = ? = = ? i l : ripple current, i & l : average coil current, f: oscillating frequency d pon : = + / + =. / +. d noff : = + C = . ? . ~ dc / dc1 (at buck) ? = ? ( v cc max : maximum input voltage, i l : inductor ripple current, v o : output voltage 1, f sw : oscillating frequency) an output current in excess of the coil current rating will caus e magnetic saturation to the coil and decrease efficiency. the following equation shows the peak current i lmax assuming the efficiency as . it is recommended to secure sufficient margin to ensure that the peak current does not exceed the coil current rating. = + use low resistance (dcr, acr) coils to minimize coil loss and increase efficiency. downloaded from: http:///
19/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 i olimit i o1 when load current is low, dc / dc1 operates discontinuously so set ? i l in a way it operates continuously (i l1 keeps continuously flowing). the condition of continuous operation is shown in the following equation. ~ dc / dc1 ?????? > ? ?? (i o1 : load current) figure 31. over current detection shielded type inductor (closed magnetic circuit) is recomm ended. open magnetic circuit type inductor can be used for low cost applications if noise is not of concern. but in this ca se, there is magnetic field radiation between the parts and thus keep enough spacing between the parts. for ferrite core inductor type, please note that magnetic saturation may occur. saturation needs to be avoided at all times. precautions must be taken into account on the given provisions of the current rating because it differs according to each manufacturer. please confirm the rated current at t he maximum ambient temperat ure of the application to the coil manufacturer. i o1 i o1 sw1 sw1 ? i l1 figure 29. continuous operation figure 30. discontinuous operation downloaded from: http:///
20/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 2. setting the output capacitor c vo1 value (dc / dc1) the maximum output current is limited by the over current protect operation current as shown in below equation. = ? ?? i o max : maximum output current, i limit min : minimum over current protect operat ion level (1ch is external set) when the ? i l is low, the inductor core loss (iron loss), the loss due to esr of the ou tput capacitor and the ? v pp will become low. ? v pp is expressed as follows: buck mode boost mode = + ? 8 = + ? ?? ( esr : output capacitor equivalence series resistance, c o : output capa citor volume) by using small esr capacitor, ? v pp voltage level can be lowered. the benefit of ceramics capacitor is low esr and small form factor. the frequency characteristic of esr from the datasheet of the m anufacturer should be confi rmed. choose the ceramic capacitor which exhibits low esr in the switching frequenc y range that is used on the other hand, dc biasing characteristics of the ceramic capacitor is significant so it needs to be carefu lly examined. for the voltage rating of the ceramic capacitor, twice or more than the maximum output vo ltage is usually required. by selecting these high voltages rating, it is possible to reduce the influence of dc bias char acteristics. moreover, in order to maintain good temperature characteristics, the one with the characteri stic of x7r or better, is recommended. because the voltage rating of ceramic capac itor is low, the selection becomes diff icult in the application with high output voltage. in that case, select electrolytic capacitor. when using electrolytic capacitors, the vo ltage rating should be 1.2 times or more than the output voltage. electrolytic capacitors have a high voltage rating, large capacity, sma ll amount of dc biasing charac teristic, and are generally inexpensive. because typical failure mode is open, it is effect ive to use electrolytic capacitor for applications where high reliability is required such as automotive. on the other ha nd, disadvantages are relatively high esr and capacitance value drop at low temperatures. in this case, please take note that ? v pp may increase at low temperature conditions. moreover, consider the lifetime characte ristic of this capacitor. the tantalum capacitor and the conductive polymer capacitor have good temperature characteristics, unlike an electrolytic capacitor. these capacitors have small amo unt of dc biasing characteri stic like the electrolytic capacitor. for the voltage rating of the tantalum capacitor, twice or more than the maximu m output voltage is usually re quired. for the voltage rating of the conductive polymer capacitor, 1. 5 times or more than the maximum output voltage is usually required. the demerits of tantalum capacitor and conductive polyme r capacitor are that a fault mode is sho rt and voltages rating is low. also the conductive polymer capacitor is expensiv e. for these reason, these capacitors are not used for automotive applications, because of its high reliability requirements. output capacitors are rated in ripple current. the rms values of the ripple electric current obtained in the next expression must not exceed the ratings of ripple electric current. = ? ?? ( i cvo rms : output ripple current rms value) downloaded from: http:///
21/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 when it comes to the capacitance c o , the value needs to be less than the value calculated by the equations below. ~ dc / dc 1 = . ? ( i limit min : minimum over current protect operat ion current (1ch is external set). soft start min time dc / dc1: 0.5 ms) boot failure may occur if the capacitance value exceeds the limits explained above. if the capacitance value is extremely large, over-current protection may be activated by the inrush current at startup, and the output may not start. please confirm this on the actual circuit. capacitance values are critical parameter to determine the lc oscillation fr equency. transient response and loop stability are dependent on the c vo . please select after confirming the setting of the phase compensation circuit. 3. setting the input capacitor c vcca / c vccb value (vcc) input capacitors reduce the po wer output impedance that is connected to v cc. two types of capacitors are needed for input capacitor, i.e., decoupling capacitor c vccb and bulk capacitor c vcca . the decoupling capacitor of vcc needs to be 1 f to 10 f ceramics. the ceramic capacitors are most effective when placed as close to vcc as possible. at vcc, the ceramic capacitors need to be placed between vcc and gnd and close to pmos and the ground of schottky barrier diode. voltage rating is recommended to be more than 1.2 times the maximum input voltage and twice the normal input voltage. the bulk capacitor prevents line voltage drop and serves as a backup power suppl y to maintain the input voltage. the low esr electrolytic capacitor with large capacitance is suitable fo r the bulk capacitor. it is necessary to select the capacitance value which best fits to each application. in case impedance of input side is high such as long wiring between the power supply and vcc, input voltage gets unstable when output impedance of the power supply increa ses resulting in oscillation or degraded ripple rejection characteristics. large capacitor is needed in this case. it is necessary to verify that the output does not turn off in the event of vcc drop due to transient in the actual circuit. make sure not to exceed the rated ripple current of the capaci tor in this case. the rms of the input ripple current can be obtained from the following equation. ~ dc / dc 1 = ? ( i cvccb rms : input ripple current rms value) in automotive and other applications requiring high reliability, it is recommended that capacito rs are connected in parallel to reduce the risk of electrolytic capacitors drying out. in ca se of ceramic capacitors, it is recommended make it two in series and two in parallel structures to reduce the risk of destruction due to short circuit event. currently capacitors containing two in series or two in parallel in one package are available in the market so please contact suppliers. figure 32. vcc pin vcc v o1 cvo1 l1 cvccb outh downloaded from: http:///
22/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 4. setting the input capacitor c vs2 value place a capacitor which is greater than 0.1 f between vs2 and gnd. select the capacitor c onsidering filter circuit for power supply and vs2. since the capacitance value is depende nt on the board layout and pattern, secure enough margin when selecting the capacitor. capacitors that have good voltage and temperature characteristics are recommended. 5. setting the output capacitor c vreg value place a capacitor between the vreg pin and gnd to avoid oscillation. 0.47 f or greater capacitance is recommended. c vreg can be electrolytic capacitor or cerami c capacitor. secure a capacitance of 0.47 f or greater in the voltage and temperature range in actual operating conditions. the change in capacitance value by temperature may cause oscillation. select the capacitors which have good temperature characteri stics (x7r or better), good dc bias characteristics with high voltage rating. in case significant voltage swing and load transient are expected, make sure to carry out thorough evaluation before making a decision on the capacitance value. 6. setting the output capacitor c vdd value place a capacitor between vdd and gnd. the capacitance needs to be 0.01 f or greater (outl = open) and1 f or greater (outl in use). c vdd can be electrolytic or ceramic. secure high enough capacitance in the voltage and temperature range in actual operating conditions. the change in capacitance value by temperature may cause oscillation. select the capacitors which have good temperature characteri stics (x7r or better), good dc bias characteristics with high voltage rating. in case significant voltage swing and load transient are expected, make sure to carry out thorough evaluation before making a decision on the capacitance value. 7. setting the internal drive circuit supply capacitor c vl value add a capacitor greater than 0.1 f between vcc and vl. sele ct the capacitor considering the filter circuit for power supply and vl. since the capacitance value is dependent on the board layout and pattern, secure enough margin when selecting the capacitor. 8. setting output voltage (v o1 ) v o2 is fixed output while v o1 is adjustable. v o1 output voltage is determined by the following equation. = .8 + please set feedback resistor rfb1b below 30 k ? to reduce the error margin by the bias current. in addition, since power efficiency is reduced when rfb1a + rfb1b is small, please set the current flowing through the feedback resistor small enough as compared to the output current i o1 . downloaded from: http:///
23/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 9. selection of the mosfet (m1, m2) in case of buck-boost dc / dc, dc / dc1 needs 2 external mosfet (pmos = m1 and nmos = m2). in case of buck dc / dc, dc / dc1 needs 1 external mosfet (pmos). key parame ters in choosing mosfet are voltage and current rating. figure 33. select mosfet ( ? ) pmos o v ds maximum rating > vcc o v gs maximum rating > lower value of 13 v or vcc * the voltage between vcc - vl is kept at 10 v (typ), 12 v (max). vl become 0 v when vcc become less than 10.3 v (typ) o allowable current > coil peak current i lmax * a value above the over current protection setting is recommended. * choosing a low on resistance fet results in high efficiency. ( ? ) nmos o v ds maximum rating > v o o v gs maximum rating > vdd o allowable current > coil peak current i lmax * a value above the over current protection setting is recommended. * choosing a low on resistance fet results in high efficiency. 10. selection of the schottky barrier diode the diode needs to be low vf and fast trr. key parameters in the diode selection are averag e rectified current and dc reverse voltage. average rectified current i f (avg) can be obtained from the following equation: = i ? ??? ( i f avg : average rectified current) the absolute maximum rating of the average rectified cu rrent needs to be 1.2 times or greater than the i f (avg) . the absolute maximum rating of the dc reverse voltage needs to be 1.2 times or greater t han the maximum input voltage. the diode power loss can be obtained by the following equation: = ? ??? ( vf : forward voltage of i o1 (max) ) selecting a diode that has low forward vo ltage and fast reverse recovery time will help achieve a high efficiency. select a diode with 0.6 v or lower forward voltage. the use of t he diode greater than 0.6 v forward voltage may cause inner element destruction so care has to be taken. the reverse recove ry time of the schottky barrier diode is so short and thus its switching loss is ignorable. if the diode needs to withstand the event of output short-circuit, absolute maximum ratings and power dissipation need to be even higher. the maximum ra ted current needs to be approximately 1.5 times of the over current detection value. the diode power loss at the event of output short-circuit can be obtained by the following equation. = ? ( i limit max : v o1 maximum over current protect operation current) downloaded from: http:///
24/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 11. setting the oscillation frequency (dc / dc1) the internal oscillation frequency can be set by changing the resistance value connected to rt pin. frequency can be set in the range of 250 khz to 600 khz. the following table shows the resistance value and its corresponding oscillation frequency. switching may stop if the oscillation frequency is set outside of the recommended frequency range and thus normal operation is not guaranteed in such case. 12. setting the phase compensation circuit (dc / dc1) circuit stability and transient response characteristics ar e determined by phase compensation. in order to get negative feedback stability, set phase lag when gain 1 (0 db) equal to or less than 135 ? (greater than 45 ? phase margin). good frequency response can be realized by setting higher zero crossing frequency fc (frequency at 0 db gain) of the total gain. however, speed and stability are in trade-off relationshi p. moreover, dc / dc converter application is sampled by switching frequency and the gain of the swit ching frequency needs to be suppressed. in order to do so, zero crossing frequency needs to be set equal to or lower than 1 / 10 of the switching frequency. to improve the responsiveness, switching frequency needs to be raised. it is recommended to draw a bode plot using the transfer function of control loop in order to get a frequency response necessary. please confirm the frequency characteristics of the total gain by comb ining the below three transfer functions. = = = ? g lc : transfer function of lc resonance, g fb : transfer function of phase compensation, g pwm : transfer function of pwm, v ramp : 0.4 v, q : lc quality factor) rt [k ? ] f osc [khz] 16 697 20 564 27 424 33 350 39 298 47 250 56 211 68 175 figure 34. rt resistance vs. oscillation frequency *the oscillation frequency graph is typical. a certain variation exists in actual usage. kkk (a) kkk (b) kkk (c) 0 100 200 300 400 500 600 700 800 0 2 04 06 08 0 oscillating frequency: fosc [khz] oscillating frequency setting resistance: rrt [k ? ] rt vs fosc downloaded from: http:///
25/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 since dc / dc1 is voltage mode, it is possibl e to add 2-pole and 2-zero compensation as follows. the frequency of zero and pole is determined by the following equations: figure 35. phase compensation circuit (dc / dc1) = = = = = f = ? ( dcr : inductor dc resistance, r o : load resistance, r on : mos fet on resistance) v o1 rfb1b rfb1c esr cvo1 cco1b rco1 cco1a dcr l1 sw1 comp1 fb1 rfb1a vref d1 erramp cfb1 rvo1 kkk (d) kkk (e) kkk (f) kkk (g) kkk (h) kkk (i) downloaded from: http:///
26/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 the frequency characteristics are optimized by placing pole and zero at most approp riate frequencies. the estimate is as follows. . . = . the phase compensation set as explained can cancel out the second order lag (-180 ? ) caused by lc resonance. if f esr is positioned higher than dc / dc switching frequency such as using low esr ceramic for output cap, f p2 is not necessary. if lc filter q (quality factor) is high, the gain has peak and phase rotates too fast resulting in not enough phase margin. in such case, set f z1 and f z2 as close to f lc as possible. q (quality factor) is calculated by following equation: q= the way to start designing phase compensation circuit is as ex plained. create a bode plot and check if targeted frequency characteristics are met. the frequency c haracteristics pretty much fluctuat e depending on pcb layout, type of components used and operating conditions. for instance, using electrolytic capacitor for output stability may cause the shift of lc resonance resulting in oscillation due to the capacitance drop at low temp and relevant esr increase. for phase compensation, temperature compensating type capacitor is recommended. make sure to check stability and responsiveness in actual product. frequency characteristics are checked by gain phase analyz er or fra. ask each vendor for measurement method. even if such measurement equipment is unavaila ble, phase margin can be estimated fr om transient load response. monitor how the output waveform fluctuates when changing from no load to maximum load. if the output fluctuation is significant, response time is slow. if the ringing is frequent, phase margin is not enough. twice or less ringing is appropriate. the phase margin however cannot be quantified in this check method. figure 36. load response kkk (j) kkk (k) kkk (l) kkk (m) kkk (n) kkk (o) phase margin: little phase margin: good output load output voltage t 0 downloaded from: http:///
27/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 13. phase compensation circuit (ldo) vo2 pin capacitor the capacitor must be added between vo2 pin and gnd in or der to prevent it from oscillating and the recommended capacitance value is more than 10uf. in accordance to the graph shown below, either electrolytic or ceramic capacitor can be used. please ensure to select a c apacitor higher than 10uf in the range of voltage and temperature to be used at. there is a possibility of oscillation when capacitance va lue changes due to change of temperature. when selecting a ceramic capacitor, x7r or higher is recommended which is goo d in temperature characteristic and has excellent dc bias characteristic. in case significant voltage swing and load transient are expected, make sure to carry out a thorough evaluation before making a deci sion on the capacitance value. condition vcc = 12 v, vs2 = 6.5 v, 0 ma i o2 600 ma, 10 f c vo2 100 f figure 37. output capacitor value c vo2 vs output capacitor esr figure 38. output capacitor and esr measurement circuit 14. provision of capacitor connected to cl terminal the capacitor (ccl) and resistor (rclb) connected to cl pi n are the cr noise filter for preventing ocp error detection. for the constant setting of filter, since noise depends on circuit and board pattern, there is no fixed rule. but, please try reducing cut-off frequency of cr filter without deteriorating on pulse waveform that requires detecting current sense. pulse width (vo1 / vcc) ~ (1 / fosc) (the rough estimate setting is rclb = several tens
, ccl = several thousand pf) figure 39. cl pin filter circuit 0.01 0.1 1 10 100 10 22 33 47 68 100 esr[ ] cvo2[uf] c vo2 vs. esr rclb ccl cl vcc outh downloaded from: http:///
28/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 0 20 40 60 80 100 120 140 160 180 200 0 0.25 0.5 0.75 1 power on reset time: por[ms] por setting capacitor: cct[ f] ct vs por 0 20 40 60 80 100 120 140 160 180 200 0 0.25 0.5 0.75 1 power on reset time: trst[ms] por setting capacitor: cct[ f] ct vs trst 15. soft start setting the soft start function is necessary to prevent inrush coil current and output volt age overshoot at start up. setting of soft start time is shown in the following equation. ~ dc / dc1 = + 16. setting the ct power on reset time power reset setting time can be set by the capacitor connected to ct capacitan ce can be chosen from 0.01 f to 1 f range or have ct terminal open. if setting is made out of its range, chattering may occur at reset output. ct operation is changed by the time of error detection. see page 13, figure 19 for detail. (1) ct pin starts 0 v figure 40. power on reset time1 (ct = 0 v to 0.8 v(typ)) (2) ct pin starts 0.2 v figure 41. power on reset time2 (ct = 0.2 v (typ) to 0.8 v(typ)) ct [ f] por [ms] 0.001 0.167 0.0082 1.09 0.01 1.62 0.022 3.46 0.033 5.24 0.047 7.64 0.068 10.8 0.1 16 0.22 36.2 0.47 76.8 1 159 ct [ f] por [ms] 0.001 0.16 0.0082 0.826 0.01 1.452 0.022 2.51 0.033 3.93 0.047 5.82 0.068 7.9 0.1 14.12 0.22 26.7 0.47 57.2 1 114.4 downloaded from: http:///
29/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 17. wdt oscillation frequency wdt oscillation frequency can be set by a resistance value connected to rtw. possible setting range is 50 khz to 250 khz and th e relation between resistance value and oscillation frequency is decided as shown below. it is possible that the switching stops at outside these range and its operation is not gu aranteed. figure 42. wdt oscillation frequency characteristics r tw [k ? ] f oscw [khz] 18 268 22 221 27 182 33 151 47 108 51 100 62 83 75 69 82 64 100 53 120 45 *this oscillation frequency graph is typical value tolerance needs to be put into consideration. 0 50 100 150 200 250 300 350 400 450 04 08 01 2 01 6 0 wdtoscillating frequency: foscw [khz] oscillating frequency setting resistance: rrtw [k ? ] rtw vs fosc downloaded from: http:///
30/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 18. recommend value of external pull - up resistance pg pin on resistance (ppupg) min = 0.5 k ? , typ = 1.0 k ? , max = 2.0 k ? > (v) please set the resistance value considering h threshold of pg pin. figure 43. external pull - up resistance 19. provision of en1 pull -up resistance because "h" threshold of en1 is min 2.5 v, please design as the below equation is able to work. > . (v) (188 k ? r en1b 750 k ? ) figure 44. en1 pull -up resistance ren1a ren1b en vcc downloaded from: http:///
31/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 application examples *there are many factors (board layout, variation of t he part, etc.) that can affe ct the characteristics. please verify and confirm using practical applications. *no connection (n.c) pin should not be connected to any other lines. *be sure to connect the test pin to ground. * if en1 pin is connected to vcc pin, please insert resistance between the pins. figure 45. application example 2 (buck - boost) # # _ downloaded from: http:///
32/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 figure 46. application example 3 (buck - mode) # # _ downloaded from: http:///
33/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 example of constant setting (dc / dc1 buck - boost) name value parts no. size code maker note ic - - bd39002efv-c 10.00 7.60 1.00 mm rohm ren 150 k mcr03 1608 rohm rrt 27 k mcr03 1608 rohm rfb1a 10 k mcr03 1608 rohm rfb1b 68 k mcr03 1608 rohm rfb1c 0.1 k mcr03 1608 rohm at buck - mode: 1.6 k rco1 4.7 k mcr03 1608 rohm at buck - mode: 36 k rrtw 47 k mcr03 1608 rohm rcla 110 m mcr10 2012 rohm rclb 110 m mcr10 2012 rohm rrst2 10 k mcr03 1608 rohm rrst3 10 k mcr03 1608 rohm rrstw 10 k mcr03 1608 rohm rpupg1 10 k mcr03 1608 rohm rpupg2 10 k mcr03 1608 rohm rpupg3 10 k mcr03 1608 rohm cvcca 47 f electrolytic capacitor - - cvccb 2.2 f gcm31cr71h225ka40 1608 murata cvreg 1 f gcm188r71c105ka49 1608 murata cvdd 1 f gcm188r11h104ka42 1608 murata at buck - mode: 0.1 f css1 0.033 f gcm188r11h333ka40 1608 murata cco1a 47000 pf gcm188r11h222ka01 1608 murata at buck - mode: 2200 pf cco1b 100 pf gcm188r11h330ka01 1608 murata at buck - mode: 33 pf cvs2 1 f gcm188r71c105ka49 1608 murata ccl 0.1 f gcm188r11h104ka42 1608 murata cvl 0.1 f gcm188r11h104ka42 1608 murata cvo1a 47 f electrolytic capacitor at buck - mode: 100 f cvo1b 44 f gcm32er71c226ke15 3225 murata at buck - mode: open cvo2 10 f gcm31cr71c106ka49 3216 murata cct 0.1 f gcm188r11h104ka42 1608 murata l1 47 h slf12565t-470m2r4-h 12.5 12.5 6.5mm tdk d1a sbd rb050l-40 2.6 5.0 2 mm rohm d1b sbd rb050l-40 2.6 5.0 2 mm rohm at buck - mode: short m1 pchfet rsd046p05 6.5 9.5 2.3 mm rohm m2 nchfet rsd080n06 6.5 9.5 2.3 mm rohm at buck - mode: open notes for pattern layout of pcb 1) design the wirings shown in bold line as short as possible. 2) place the input ceramic capacitor cvccb as close to m1 as possible. 3) place the rrt and rrtw as cl ose to gnd pin as possible. 4) place the rfb1a and rfb1b as close to fb1 pin as po ssible and provide the shorte st wiring from fb1 pin. 5) place the rfb1a and rfb1b as far away from l1 as possible. 6) separate power gnd and signal gnd so that sw noise doesnt affect the signal gnd. downloaded from: http:///
34/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 power dissipation maximum junction temperature tj is 150 c. if the junction temperature reaches 175 c or higher, the circuit will shut down. please make sure that the junction temper ature must not exceed 150c at all time. for thermal design, be sure to operate the ic within the following conditions. (since the temperatures described hereunder are all guaranteed temperatures, take margin into account.) 1. ambient temperature ta is less than 125 c. 2. tj is less than 150 c. temperature tj can be calculated by two ways as below. 1. to obtain tj from the ic surface te mperature tc in actual use 2. to obtai n tj from the ambient temperature ta = + = + the heat loss of the ic (p total ) is calculated by the equation below. = + + ~ dc / dc1 (at buck) = + + + figure 47. sw1 wave form ~ ldo = C + r onh1 : on resistance of external pch-powtr, v o1 : dc / dc1 output voltage, v o2 : ldo output voltage, v cc : input voltage (vs2 = v o1 ), io 1 : dc / dc1 output current, io 2 : ldo output current i cc : circuit current (see page 5) tr 1 : switching rise time (about15 ns) tf 1 : switching fall time (about 35 ns) f: oscillation frequency see the thermal derating characteristi cs (figure 48) if the device used over the ambient temperature ta = 25 c. the characteristics of ic largely depend on temperature, and the ic must be us ed at maximum junction temperature (tjmax) or lower. even if the ambient temperature is 25 c, there is a possibility junction temperature gets high as consequence of input voltage and load current. the ic must be used within power dissipation pd. thermal resistance value ja is varied by the number of layers and copper foil area of the pcb. see figure 48 for the thermal design. = ? ? + = ? + downloaded from: http:///
35/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 thermal derating characteristics ic mounted on rohm standard board ~ board size: 70 mm 70 mm 1.6 mm ~ pcb and back metal are connected by soldering ? 1 layer board 70 70 1.6 mm (copper foil area 0 mm 0 mm) ? 2 layer board 70 70 1.6 mm (copper foil 15 mm 15 mm) ? 2 layer board 70 70 1.6 mm (copper foil 70 mm 70 mm) ? 4 layer board 70 70 1.6 mm (copper foil 70 mm 70 mm) board ? : ja = 80.6 c / w board ? : ja = 65.8 c / w board ? : ja = 36.8 c / w board ? : ja = 26.6 c / w figure 48. package data of htssop-b30 (reference data) 0 1 2 3 4 5 6 0 25 50 75 100 125 150 power dissipation: pd (w) ambient temperature: ta (c) ? 4.69w ? 3.39w ? 1.89w ? 1.55w downloaded from: http:///
36/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 i / o equivalence circuit 1. vl 3. outh 5. cl 6. vcc 7. en1 8. t3, 12. t4 9. vreg 10. en2 11. sel_uvlo 13. vs2 14. vo2 15. pg2, 16. pg1 downloaded from: http:///
37/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 i / o equivalence circuit - continuance 17. rstwd# 18, rst2# 19. enwd 20. clk 21. ct 22. rtw, 23. rt 25. ss1 26. comp1 27. fb1 28. vdd 29. outl 30. pgnd1 # downloaded from: http:///
38/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can da mage the ic. please make sure to have protection against reverse polarity, such as putting an external diode between the power supply and the ics power supply pins. 2. power supply lines power supply line must be low impedance on the pcb. the power supply of digital and analog must be separated (even if the electrical potentials ar e the same) to prevent analog circuit from having digital noise by common impedance of line pattern (ground line must be designed in the same way) furthermore, connect a capacitor to ground at all power su pply pins. consider the effect of temperature and aging on the capacitance value when usi ng electrolytic capacitors. 3. ground voltage ensure that ground pin must have the lowest electrical potential at all time even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces shou ld be routed separately, but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground voltage caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the pd is s pecified at the condition of 70mm x 70mm x 1.6mm glass epoxy board. in case of exceed ing this absolute maximum rating, increase the board size or copper area to prevent the ic from exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the spec ified characteristics can be approximately obtained. the electrical characteristics are guaran teed under the specified conditions. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, powe r wiring, width of ground wiring, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to protect ic from static discharge damage, ground the ic duri ng assembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. make sure that there is nothing between the pins, such as no metal particles, no water droplets (in very humid environment) and unintentional solder bridge deposited. downloaded from: http:///
39/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 operational notes ? continued 10. unused input pins input pins of an ic are often connec ted to the gate of a mos transistor. t he gate has extremely high impedance and extremely low capacitance. if input pins left unconnected, the electric field fr om the outside can easily charge it. the small charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 11. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lowe r than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. in the construction of this ic, p-n junc tions are inevitably formed creating parasi tic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circui ts, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoi ded. furthermore, do not apply a volt age to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in t he electrical characteristics of this ic. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric c onstant with the consideratio n of the capacitance charge with temperature and the decrease in nomin al capacitance due to dc bias and others. 13. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period of time, the junction temperature (tj) rises, and tsd activated, which turns off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute ma ximum ratings. under no circumstances, tsd circuit should not be used for any purpose other than protecting the ic from exceeding the maximum rating. 14. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is designed to avoid ic damaged from sudden and unexpected incidents, so should not be used in applications characterized by continuous opera tion or transitioning of the protection circuit. 15. power input at shutdown if vcc starts up in rapid period of time at shutdown (en1 = off), vreg voltage may be output, which causes the ic to malfunction. therefore, set the vcc rise time at 40v/ms or shorter. downloaded from: http:///
40/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 16. reverse polarity and surge voltage ? if the vcc and pin potential are reversed, internal circui t or element may be damaged (example: vcc is shorted to gnd while external capacitor changed) putting diode for re verse protection in series of vcc or putting bypass diode between vcc is recommended. ? if the vs2 and pin potential are reversed, internal circuit or element may be damaged (example: vcc is shorted to gnd while external capacitor changed) putting diode for re verse protection in series of vcc or putting bypass diode between vcc is recommended. ? applying positive surge to the vcc if there is apossibility of surge exceeding the rating appl ied to vcc, please put a power zener diode between vcc and gnd. ? applying negative surge to the vcc if there is a possibility that vcc gets lower than g nd, please put a schottky diode between vcc and gnd. ? protection diode if there is a possibility of large inductive load is connect ed to the output pin (vo2) resulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. vs2 gnd v o2 vs3 downloaded from: http:///
41/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 ordering information b d 3 9 0 0 2 e f v - c ? e 2 part numbe r package efv: htssop-b30 for in-vehicle packaging and forming specification e2: reeled, embossed taping marking diagram htssop-b30 (top view) bd39002efv part number marking lot numbe r 1pin mark downloaded from: http:///
42/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 physical dimension, tape and reel information package name htssop-b30 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin downloaded from: http:///
43/43 datasheet d a t a s h e e t bd39002efv-c ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0t2t0am00200-1-2 oct.29.2014 rev.001 revision history date revision changes 2014.10.27 001 new release downloaded from: http:///
notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extraordinary environments or conditions, as exemplified bel ow . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our pr oducts under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using wate r or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mo unted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommend ed. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range d escribed in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with t he rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin co nsidering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensatio n [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is ind icated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. al l information and data including but not limited to applic ation example contained in this document is for reference only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modifie d, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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